Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
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Details of TSFC bonding interfaces: tool/chip and bump/pad interface.
PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
PDF] Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
Electronics, Free Full-Text
Modeling study of thermosonic flip chip bonding process - ScienceDirect